Heat dissipation materials such as thermal conductive silicone gel and graphite sheets are commonly used in heat dissipating devices. Thermal conductive silicone gel, which is non-conductive, offers high adhesive structural properties and extremely effective heat conduction. It's currently the best thermal solution for CPU, GPU, and heat sink contact. Graphite sheets boast high heat dissipation efficiency, occupy minimal space, are lightweight, and conduct heat evenly in two directions. They effectively eliminate 'hot spot' areas.
